EasySpheres Blog

Choosing between bulk and taped solder spheres depends on how your production team handles, feeds, and places solder balls. Bulk packaging can suit flexible handling and certain rework workflows, whi … read more

Lead-free solder alloys are tin-based alloys that contain no intentionally added lead. They replaced tin-lead solder in most electronics assembly after the RoHS Directive restricted lead, and they are … read more

Engineers stacking two circuit boards, or mounting a module onto a board, often need a guaranteed gap between them. A standard solder ball melts and collapses, so the gap is hard to control. High-lea … read more

The correct solder ball size for BGA reballing is the diameter specified for the particular BGA package and reballing process. EasySpheres supplies solder spheres for BGA reballing in lead-free and ti … read more

A continuation of our : ASK the Expert Series : Explore expert insights on intermittent BGA test issues and discover common solder joint defects and possible solutions. Intermitt … read more